Trunk Cable & Fan-out Cord
. High-density connection with multi-core (up to 24C) support
. Male an Female type classfication with Guide Pin
. Push-Pull type connecting for Easy & Fast Installation
. 40/100Gbps Parallel Transmission (IEEE 802.3ba) support solution
. Ferrule inspection data sheet included with all shipments
. Small form factor and high density applications

OM4, OM3 12C Fiber Fan-out for 40G/100G
LS Simple Fast-Net™ MTP solution is pre-terminated solution which means it can easily expand or relocate systems without relocating patch cords and cassette.
Therefore it can be applied to maintenance of currently operating solution to respond flexibly to the customers who consider physical configuration, space-efficiency and future scalability. Data Center designers have always strived to make the reliable, manageable, flexible and scalable data center according to ANSI/TIA-942 Standard or others and this standard will continue to add value as we transition into higher 40G and 100G data rates by multi fiber unit cabling. The LS Simple Fast-Net™ 40G or 100G parallel optics fiber MTP can support with any cabling environment for data center room to save space within patching management area the same time providing robust and safe transition.

Fan-out Cord(LSZH), OM3, MTP QSFP or CXP+ to SFP+ Harness
MTP 40G Harness standard
MTP(Non-pinned) – LC(Duplex): 8-fibers
• Fan-out Cord(LSZH), OM3
• Low-loss IL support :Normal IL 0.35dB under.
• LC 8Cores Multi-Pair Fan-out cord
• Optimal optical performance through high quality ferrules
• 100% factory tested for insertion & return Loss
• Harness connectivity from 12 to 8 fibers
• Higher return on investment and reduced capitalization and installation costs

MPO/MTP Trunk & Fan-out Cord
. High-density connection with multi-core (up to 24C) support
. Male an Female type classfication with Guide Pin
. Push-Pull type connecting for Easy & Fast Installation
. 40/100Gbps Parallel Transmission (IEEE 802.3ba) support solution
. Ferrule inspection data sheet included with all shipments
. Small form factor and high density applications